Public market insider selling at Celestica (CLS)

Public market insider selling at Celestica (T:CLS)

Updated Wednesday Oct 30, 2024 02:26 AM EDT

Robert Andrew Mionis, CEO and Director, disposed of 150,000 Common Shares on a direct ownership basis at a price of US$69.661 on October 28th, 2024. This represents a $14,519,094 divestment of the company's shares and an account share holdings change of -20.2%.

Mandeep Chawla, CFO, disposed of 13,400 Common Shares on an indirect ownership basis for registered holder Mandeep Chawla RRSP at a price of $96.260 on October 28th, 2024. The insider also disposed of 8,700 Common Shares on an indirect ownership basis for registered holder Mandeep Chawla TFSA at a price of $96.810 on October 28th, 2024. The insider also disposed of 7,900 Common Shares on a control or direction basis for registered holder RESP at a price of $96.080 on October 28th, 2024. This represents a $2,891,163 divestment of the company's shares and an account share holdings change of -100.0%.

Celestica is in the Electronic Equipment & Parts Sub Industry Group under the Technology Sector.

Celestica Inc. is engaged in designing, manufacturing and providing hardware platform and supply chain solutions. It delivers supply chain solutions globally to customers in two operating segments: Advanced Technology Solutions (ATS) and Connectivity & Cloud Solutions (CCS). The ATS segment consists of its ATS end market and is comprised of its Aerospace & Defense (A&D), Industrial, HealthTech, and Capital Equipment businesses. Its Capital Equipment business is comprised of its semiconductor, display, and robotics equipment businesses. The CCS segment consists of its communications and enterprise end markets. The enterprise end market is comprised of Celestica's servers and storage businesses. It offers a range of product manufacturing and related supply chain services to customers in both of its segments, including design and development, new product introduction, engineering services, component sourcing, electronics manufacturing and assembly, testing, and systems integration.